medical technologist Sunnyvale, CA
Job description
Minimum qualifications:
- Bachelor's degree in Material, Electrical, Technology, Science, a related field, or equivalent practical experience.
- 6 years of experience in industry package development for production.
Preferred qualifications:
- Experience in Chip Package Interaction (CPI), packaging materials, process, thermal, and package design.
- Knowledge of 2.5D silicon interposer, silicon bridge technologies and advanced chip package technologies for high pin count, high power and high speed applications.
- Understanding of advance foundry process node and its interaction with package reliability and different package technology.
- Understanding of multidisciplinary interactions between packaging technology, chip package electrical design, thermal and mechanical performance and reliability.
- Knowledge of package assembly process and reliability requirements (component and board level).
About the job
Our computational challenges are so big, complex and unique we can't just purchase off-the-shelf hardware, we've got to make it ourselves. Your team designs and builds the hardware, software and networking technologies that power all of Google's services. As a Hardware Engineer, you design and build the systems that are the heart of the world's largest and most powerful computing infrastructure. You develop from the lowest levels of circuit design to large system design and see those systems all the way through to high volume manufacturing. Your work has the potential to shape the machinery that goes into our cutting-edge data centers affecting millions of Google users.
As a Chip Packaging Technologist, you will work on the package development of broad chip package technologies. You will lead technical aspects of the assembly process, package design and material, and reliability tests. You will perform early feasibility studies using test vehicles and creation of specifications. In this role, you will provide guidance for thermal, mechanical, electrical, and package substrate design. You will also lead package design reviews and solve technical issues associated with package reliability, process, thermal, and electrical issues. Additionally, you will work with cross-functional teams from different organizations and various vendors to incorporate their inputs into the package development and production.
The US base salary range for this full-time position is $146,000-$220,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process.Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google.
Responsibilities
- Define multi-chip package mechanical, thermal, electrical, and reliability requirements in the beginning of the package development stage.
- Establish a package development engineering plan and conduct package Design of Experiment (DOE) using mechanical/thermal test vehicles and finalize package design, assembly process, and material specification.
- Work with the Chip Design team to define boundaries of chip development in terms of package Design for Manufacturability (DFM), electrical, thermal, and reliability.
- Collaborate with multi-functional internal teams, Outsourced Semiconductor Assembly and Tests (OSATs), and material suppliers to deliver chip package solutions for production.
- Establish the chip package technology roadmap aligned with the chip and system product roadmap.
About Google
CEO: Sundar Pichai
Revenue: $10+ billion (USD)
Size: 10000+ Employees
Type: Company - Public
Website: goo.gle/3ygdkgv
Year Founded: 1998
