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Job Description

Embedded Multi-die Interconnect Bridge (EMIB) is an elegant and cost-effective approach to in package high density interconnect of heterogeneous chips. The industry refers to this application as 2.5D package integration. Instead of using a large silicon interposer typically found in other 2.5D approaches, Embedded Multi-die Interconnect Bridge (EMIB) uses a very small bridge die, with multiple routing layers. This bridge die is embedded as part of our substrate fabrication process.

To deliver this silicon technology Intel's F11x Thin Films Development Group is looking for an experienced Thin Films Technology Development Process Engineer to help develop EMIB technology at the Rio Rancho Technology Development center in Rio Rancho, New Mexico.
As a Thin Films Technology Development Process Engineer you will be responsible for:

• Development and sustaining of Thin Films processes for next generation EMIB technology development and transfer to high volume manufacturing.

• Develop Thin Films processes that meet quality, reliability, cost, yield, productivity, and manufacturability requirements for HVM.

• Plan and conduct experiments to fully characterize Thin Films processes throughout the development cycle.

• Work closely with process integration, device, and the other unit process areas to define the process technology roadmap and turn that roadmap into reality.

• Engage closely with tool vendors for process development and sustaining issues. Drive escalations and ensure resolution to any process and/or equipment problems.

• Establish process control systems to meet key quality metrics.

• Develop solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools.

• Define and maintain procedures for the module.

• Train production/receiving process engineers, and manufacturing technicians for transfer to other factories.

Qualifications

Minimum Required Qualifications:

The ideal candidate must have one the following Education requirements:

• PhD degree in Electrical Engineering, Chemical Engineering, Material Science, Physics or Chemistry with 2+ years of process engineering experience in the semiconductor industry.

• Master's degree in Electrical Engineering, Chemical Engineering, Material Science, Physics or Chemistry with 4+ years of process engineering experience in the semiconductor industry.

• B.S. degree in Electrical Engineering, Chemical Engineering, Material Science, Physics or Chemistry with 5+ years of process engineering experience in the semiconductor industry.

Preferred Qualifications:

• Ideal candidate will have 5+ years process engineering experience in Plasma Enhanced Chemical Vapor Deposition process development (PECVD Oxide/Nitride films) in semiconductor or MEMS applications.

• Familiarity with multiple characterization techniques including, but not limited to XSEM, TEM, STEM, XPS, VPD, TXRF, as well as thing films metrology such as ellipsometry and stress characterization.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Covid Statement

Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html

Working Model

This role will require an on-site presence.

JobType

On-site Required